The world of short range technologies are now being deployed in all areas. They were never previously necessary until now, but we live in the wireless age. In the near future all technology in the home and workplace will be wireless. This has begun with mobile phones, next in line are home entertainment systems and computers. In the future all home appliances will have some wireless functions. For example a broken washing machine will be accessed and analyzed by an engineer remotely.
This means that every electronic product will require an in-house wireless expertise, or there will be PCB compatible wireless systems, a Full Wireless System in Package. The advances in technology have so far been greatest for portable electronics devices such as mobile phones and MP3 players. There has been a development of System in Package (SiP) which is less expensive than the previously used SOC solution.
SiP combines all components into a single package. This came about because of the need for miniaturization in devices. There are many devices which need to transmit signals and this has let to the more recent development of Antenna in Package RF design. The miniaturization RF circuit technology has proven to be very effective by reducing the complexity of semiconductors.
Of course it is necessary to find an expert in ultra miniature antenna in package design such as Insight SiP. Over the last few years Insight SiP have been developing systems to cope with the new demands on the semiconductor industry. Antenna design is vital because so many devices require antennas. Mobile phones have traditionally had them separate to other components. Antenna in Package has allowed for them to be located in a single module with all other components.
Antenna in package has many benefits thanks mostly to the fact that the design is now less complex. This means that new circuits are easier to design and build. This in turn means a shorter time to market and lower costs. Less power is used when AiP RF design is used because there are less wires. The miniaturization digital circuit technologies are changing the way new products are made.
This means that every electronic product will require an in-house wireless expertise, or there will be PCB compatible wireless systems, a Full Wireless System in Package. The advances in technology have so far been greatest for portable electronics devices such as mobile phones and MP3 players. There has been a development of System in Package (SiP) which is less expensive than the previously used SOC solution.
SiP combines all components into a single package. This came about because of the need for miniaturization in devices. There are many devices which need to transmit signals and this has let to the more recent development of Antenna in Package RF design. The miniaturization RF circuit technology has proven to be very effective by reducing the complexity of semiconductors.
Of course it is necessary to find an expert in ultra miniature antenna in package design such as Insight SiP. Over the last few years Insight SiP have been developing systems to cope with the new demands on the semiconductor industry. Antenna design is vital because so many devices require antennas. Mobile phones have traditionally had them separate to other components. Antenna in Package has allowed for them to be located in a single module with all other components.
Antenna in package has many benefits thanks mostly to the fact that the design is now less complex. This means that new circuits are easier to design and build. This in turn means a shorter time to market and lower costs. Less power is used when AiP RF design is used because there are less wires. The miniaturization digital circuit technologies are changing the way new products are made.
SHARE
